Plasma cleaning dedicated cathode

 1. Overview of Plasma Cleaning Equipment  

Plasma cleaning is a surface treatment technology that utilizes highly reactive components (electrons, ions, radicals, etc.) in ionized gas (plasma) to remove organic contaminants/oxides or enhance material surface properties. Core equipment typically includes:  

- Plasma generator: Creates high-frequency (RF, microwave) or DC electric fields to ionize gases  

- Vacuum chamber (or atmospheric system): Provides controlled reaction environments  

- Gas delivery system: Supplies process gases (e.g., O₂, Ar, N₂, CF₄)  

- Control system: Regulates power, pressure, duration, and other parameters  

- Key components: Nozzles and electrodes that directly impact plasma excitation, delivery, and cleaning efficacy 

2. Our Products: Specialized Plasma Cleaning Nozzles and Electrodes  

We specialize in designing and manufacturing high-performance plasma cleaning nozzles and electrodes, providing critical components for semiconductor, medical device, and new energy industries to ensure efficient and stable cleaning processes.

(1) Plasma Cleaning Nozzles  

Function:  

Precisely direct plasma streams while controlling treatment area and uniformity  

Product Features:  

- Material expertise: Optimal material selection based on client requirements  

- Diverse configurations:  

  1. Direct-jet: High-energy cleaning for localized photoresist stripping/etching  

  2. Rotary: Uniform coverage for curved surfaces/large-area cleaning  

  3. Multi-orifice diffuser: Reduces thermal load to protect sensitive materials  

  4. Customization: Design optimization for specific process needs  

Typical Applications:  

- Semiconductor packaging (bond pad oxide removal)  

- Display manufacturing (ITO glass cleaning)  

- Medical catheter surface activation

(2) Plasma Cleaning Electrodes  

Function:  

Efficiently excite plasma while influencing energy distribution and cleaning rates  

Product Advantages:  

- High-conductivity & heat-resistant materials:  

  - Silver-plated copper electrodes: Low impedance for high-frequency RF applications  

  - Tungsten electrodes: Sputtering-resistant for high-power etching  

- Structural options:  

  1. Pin-type: Precision positioning for micro-structure processing  

  2. Cooling configurations: Water/air-cooled designs prevent thermal deformation  

Typical Applications:  

- Photovoltaic cells (silicon wafer cleaning)  

- Precision optical components (pre-coating treatment)  

- 3D-printed parts (residual powder removal)

3. Why Choose Our Nozzles and Electrodes?  

• High reliability: Rigorous material screening ensures prolonged stable operation  

• Customization support: Design optimization for specific process requirements.